Most PUR hot melt adhesive manufacturers worldwide will continue to be able to recover from the 2013 surplus in production, and continue to stimulate the growth of electronic products, in order to significantly boost global sales growth TP panel fasteners. The next industrial PUR hot melt adhesives industry will maintain a high growth momentum. According to the growth rate from 2011 to 2014 to calculate the global industry sales are expected to grow at an annual PUR Hot Melt 8% growth rate of 6 screen, to reach $ 8.9 billion in 2016. 2014, JSW industry is supplied to the assembly of the largest corporate PUR hot melt adhesive products, and is expected until 2016, the product will see the largest growth. Meanwhile, the mobile phone manufacturing output and accelerating growth of digital investment will also promote the use of PUR hot melt adhesive volume growth. Competition from alternative connection (such as adhesives) will not inhibit the PUR hot melt adhesives sales growth in some market segments. Glued object size, the size, shape, thickness, being sticky or the forces bonding joints, the joint design form allows bonding, bonding area, is also important to select the PUR hot melt conditions. Large part due to the large bond bonding area, but also consider the use of glue time election PUR hot melt adhesives. Sticky substance to be permitted in accordance with the process conditions selected glue, PUR hot melt adhesive must be selected according to the actual situation, everything from reality, rational selection and use of PUR Hot Melt Adhesive achieve bonding purposes. According to the force size, choose the appropriate pressure presses. Alternating hot and cold a great impact on the joints. Because they are different sticky materials, the thermal expansion coefficient PUR Hot Melt Adhesive different bonding interface will produce stress, high temperature resistance, good selection, good toughness PUR Hot Melt Adhesive bonding to the corresponding material effect do . By adhesive bonding joints can be connected as a whole sticky substance transition, PUR hot melt adhesive bonding joints in the external force to achieve the shear, tensile, peeling and uneven pull off requirements. Cohesive failure (PUR hot melt adhesive layer destruction), was destroyed sticky parts, interfacial failure (adhesive failure), mixed failure does not occur. Some advanced countries in the world have PUR hot melt adhesives are widely used in the electronics industry, in recent years, China has also started, but higher import prices PUR hot melt adhesives and coating equipment has to be imported, high prices. Taiwan Shengwei Group developed the PUR hot melt adhesives and gluing equipment has been used successfully in some enterprises, widely promoted, but also for our PUR hot melt adhesive bonding industry has opened up new avenues.