JSW3542 electronic glue called the moisture curing reactive polyurethane hot melt adhesive, its mechanism is a polyurethane prepolymer reacted with moisture in the air, to form a stable chemical structure of the electronic glue curing crosslinking. Sizing convenient, low melting point, 110 ℃ to sizing. Widely used in mobile phones, tablet computers narrow border adhesive solutions, electronic glue has good weather resistance: Because after the bridge have irreversible characteristics, and thus will not be affected by changes in ambient temperature creep and brittle hair. High toughness, tack and strong, with a strong permeability and affinity, the adhesive strength of 40% to 60% higher than other adhesives under the same conditions, reducing the amount of adhesive. Electronic glue uniformly excellent impact resistance. Various substrates with good adhesion properties. Electronic glue Features: (1) good adhesion: a variety of substrates can be bonded (e.g., PP, PC, ABS, PMMA, metal, glass, etc. TP lens bonding) above is a brief electronic glue, need detailed Please enter the gold Shengwei Guan data network to download. The following is an electronic glue informal information purposes only. JSW will constitute the brand value of in-depth research, electronic glue has some scientific, but its shortcomings can not be ignored, which constitute our analysis of competitive factors in the brand has a positive reference for the role. Components of electronic glue brand value in a number of specific aspects of the performance of component factors of brand competitiveness, but the performance is competitive with electronic glue brand value also has some limitations. Competitive market is more competitive within the industry, various enterprises and electronic glue between brands, between different industries, generally do not have the possibility of direct comparison of competitiveness. Entrepreneurs also attaches great importance to our country in the electronics industry reform glue to seize the initiative. In the "electronic glue strategic emerging industry development plan" proposed energy-saving and environmental protection industry, focusing on the development of a new generation of smart technology industry, biological industry, high-end equipment manufacturing industry, electronic glue the new energy industry, new materials industry and other strategic emerging industry of electronic glue direction and major tasks. "Strategic" strategic emerging industries is mainly reflected in three aspects: First, can significantly enhance the capability of independent innovation of electronic glue; second, to significantly enhance capacity for sustainable development of electronic glue; the third is to make more in-depth intelligence products participate in international competition, and seeking a place in the new round of global electronic glue industrial restructuring and technological revolution. The most important is the third point. Since Taiwan Shengwei (International) in 1996 for the first time the use of natural resin artificial elements after transformation, physicists realized that, in order to recognize electronic glue synchronized research. Focus electronic glue, with a certain amount of resin is bonded to guide and constrain the beam, so that acceleration along a predetermined curing. All of these require high precision and advanced technology integration and cooperation. Electronic glue can effectively replace welded some occasions, riveting, threaded connections and other mechanical connections. At present, the application of electronic glue has infiltrated into all sectors of the national economy, industrial production has become an indispensable technology, used in the high-tech field is very extensive, the beginning of this century, due to the development of various types of synthetic resin and synthetic rubber success, especially some representative polymer electronic glue such as phenolic resins, urea-formaldehyde resin, unsaturated resin, epoxy resin, chloroprene rubber, production and commercialization, to promote the rapid development of modern electronic glue and adhesive technology . Since 2010, the adhesive bonding technology and significant progress, the new high performance electronic glue emerging, and because of the unique adhesive technology, it has extraordinary versatility, able to achieve multiple objectives. Therefore, to obtain a more widely used.